Some applications cannot tolerate the high heat used to make a solder connection. These include printed circuits on certain plastics which will melt or warp if exposed to reflow temperatures. Also, many electrical components are not rated for the high reflow temperatures. The answer is a conductive adhesive.
offers options of one and two-part silver filled materials
when the highest conductivity is needed. If a lesser degree
of conductivity is an option, our nickel filled systems will
provide more economy. Most of our materials can be stencil
or screen printed, or dispensed from syringes for machine placement.