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Microelectronics

Microelectronics
Proper adhesives and encapsulants are a key part of integrating chip level components to the PCB. Many factors must be considered like adhesion to all the substrates, the right rheology and stress imparted to the chips and wire bonds.

Polymark has materials for bonding the die and insuring either the electrical isolation or conductivity, encapsulating or globbing over a die, potting of the chip area and final lid sealing.

 

 

At Polymark, we can select from our assortment of chemistries to customize a solution for you. From enhanced thermal or electrical conductivity, special rheological concerns, curing options, and expansion issues, we will find the right solution to your need.

If you can’t find your answer here, we may have the right variation in our formulary inventory.

Die Attach Adhesives - for bonding various components and silicon die
Product Description
437-91-N-1 Adhesive used for LED attachment, nickel filled - Download PDF
DA-5522-S Silver filled, flexible with excellent moisture resistance - Download PDF

IC Encapsulants - useful for protection of bare silicone die
Product Description
EN-7826-M Glob top providing low CTE and low stress - Download PDF
A438 One-part clear, heat-cure silicone provides protection for wire bonded and other devices - Download PDF

Lid Sealant
Product Description
A443 One-part, heat curing silicone adhesive - Download PDF
   

 

Note* Polymark has additional products other than those listed. If one of the above products doesn’t meet your requirements, please contact your Polymark representative or use the Contact Polymark link to inquire about other options.


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