Electronic Potting/Encapsulation 2018-03-16T12:55:13+00:00

Electronic Potting / Encapsulation

Overview

Many potting applications have a specific set of design requirements.  A design engineer should consider many factors in choosing the best electronic potting/encapsulant for a robust design. Some considerations are:

  • Operating Moisture Environment
  • Temperature Extremes
  • Component and Housing Substrates
  • Fragility of Solder Joints
  • Allowable Time for Potting and Curing
  • Thermal Dissipation Requirement
  • Mechanical Toughness Requirement
Electronic Potting / Encapsulation

Polymark’s engineers have your advanced technology formulated resin solution.
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Polymark’s engineers have your advanced technology formulated resin solution.

GET A QUOTE TODAY

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