Microelectronic Materials
Overview
Polymark has materials to cover (glob) the die and insuring electrical isolation and mechanical strength. Our thermal greases are reworkable (or non-curing) and thermally conductive.
Technical Data Sheets
Thermal Greases – Becomes a Thermal Interface between semiconductor devices and heat sinks.
Glob Top Encapsulants – Provides protection against moisture, chemicals and contaminants.
Polymark’s engineers have your advanced technology formulated resin solution.
Polymark’s engineers have your advanced technology formulated resin solution.
